BOND TECHNOLOGY LIMITED

BOND TECHNOLOGY LIMITED was incorporated on 24-JAN-1995 as a Private company limited by shares in Hong Kong. It's company registration number is: 0503753.The Company Status: Dissolved.

• CR No: 0503753
• Company Name: BOND TECHNOLOGY LIMITED
• Company Name (Traditional Chinese): 怡邦科技有限公司
• Date of Incorporation: 24-JAN-1995
• Company Type: Private company limited by shares
• Status: Dissolved
• Remarks: Dissolved by Striking Off
• Winding Up Mode: -
• Date of Dissolution: 19-JUN-2009
• Register of Charges: Unavailable
• Important Note: -
• Name History: 24-JAN-1995 BOND TECHNOLOGY LIMITED
  怡邦科技有限公司
• Updated: 24-JAN-1995
• Previous: BONSEY DESIGN ASIA PACIFIC LIMITED
• Next: BEST WOOD INTERNATIONAL LIMITED

• What is the CR No of BOND TECHNOLOGY LIMITED company?
• The CR No of BOND TECHNOLOGY LIMITED is 0503753
• What is the registration or incorporation date of BOND TECHNOLOGY LIMITED company?
• The BOND TECHNOLOGY LIMITED was incorporated on 24-JAN-1995
• What is the company type description of BOND TECHNOLOGY LIMITED company?
• The company type description of BOND TECHNOLOGY LIMITED company is Private company limited by shares
• What is the address of BOND TECHNOLOGY LIMITED company?
• The address of BOND TECHNOLOGY LIMITED company is Unavailable
• What is the postal code of BOND TECHNOLOGY LIMITED company?
• The postal code of BOND TECHNOLOGY LIMITED company is Unavailable