BONDSEMI TECHNOLOGY LIMITED was incorporated on 26-MAY-2010 as a Private company limited by shares in Hong Kong. It's company registration number is: 1460759.The Company Status: Dissolved.
| CR No. | 1460759 |
| Company Name | BONDSEMI TECHNOLOGY LIMITED |
| Company Name (Traditional Chinese) | 振邦微科技有限公司 |
| Date of Incorporation | 26-MAY-2010 |
| Company Type | Private company limited by shares |
| Status | Dissolved |
| Remarks | Dissolved by Deregistration |
| Winding Up Mode | - |
| Date of Dissolution | 17-JUL-2015 |
| Register of Charges | Unavailable |
| Important Note | - |
| Name History | 26-MAY-2010 BONDSEMI TECHNOLOGY LIMITED 振邦微科技有限公司 |
| Updated | 26-MAY-2010 |
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| What is the CR No of BONDSEMI TECHNOLOGY LIMITED company? |
| The CR No of BONDSEMI TECHNOLOGY LIMITED is 1460759 |
| What is the registration or incorporation date of BONDSEMI TECHNOLOGY LIMITED company? |
| The BONDSEMI TECHNOLOGY LIMITED was incorporated on 26-MAY-2010 |
| What is the company type description of BONDSEMI TECHNOLOGY LIMITED company? |
| The company type description of BONDSEMI TECHNOLOGY LIMITED company is Private company limited by shares |
| What is the address of BONDSEMI TECHNOLOGY LIMITED company? |
| The address of BONDSEMI TECHNOLOGY LIMITED company is Unavailable |
| What is the postal code of BONDSEMI TECHNOLOGY LIMITED company? |
| The postal code of BONDSEMI TECHNOLOGY LIMITED company is Unavailable |