BONDS TECHNOLOGY LIMITED was incorporated on 26-Sep-2003 as a Private company limited by shares in Hong Kong. It's company registration number is: 0863313.The Company Status: Dissolved.
| CR No. | 0863313 |
| Company Name | BONDS TECHNOLOGY LIMITED |
| Company Name (Traditional Chinese) | 邦時科技有限公司 |
| Date of Incorporation | 26-Sep-2003 |
| Company Type | Private company limited by shares |
| Status | Dissolved |
| Remarks | Dissolved |
| Winding Up Mode | - |
| Date of Dissolution | 06-Nov-2015 |
| Register of Charges | Unavailable |
| Important Note | - |
| Name History | 2003-9-26 BONDS TECHNOLOGY LIMITED 邦時科技有限公司 |
| Updated | 26-Sep-2003 |
| Previous: BONDS INTERNATIONAL TRADING LIMITED Next: BEST POWER TRANSPORTATION LIMITED |
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| What is the CR No of BONDS TECHNOLOGY LIMITED company? |
| The CR No of BONDS TECHNOLOGY LIMITED is 0863313 |
| What is the registration or incorporation date of BONDS TECHNOLOGY LIMITED company? |
| The BONDS TECHNOLOGY LIMITED was incorporated on 26-Sep-2003 |
| What is the company type description of BONDS TECHNOLOGY LIMITED company? |
| The company type description of BONDS TECHNOLOGY LIMITED company is Private company limited by shares |
| What is the address of BONDS TECHNOLOGY LIMITED company? |
| The address of BONDS TECHNOLOGY LIMITED company is Unavailable |
| What is the postal code of BONDS TECHNOLOGY LIMITED company? |
| The postal code of BONDS TECHNOLOGY LIMITED company is Unavailable |