GOLD BOND ENGINEERING MATERIALS LIMITED was incorporated on 29-JUL-2006 as a Private company limited by shares in Hong Kong. It's company registration number is: 1063221.The Company Status: Dissolved.
| CR No. | 1063221 |
| Company Name | GOLD BOND ENGINEERING MATERIALS LIMITED |
| Company Name (Traditional Chinese) | 金邦工程物料有限公司 |
| Date of Incorporation | 29-JUL-2006 |
| Company Type | Private company limited by shares |
| Status | Dissolved |
| Remarks | Dissolved by Deregistration |
| Winding Up Mode | - |
| Date of Dissolution | 23-JUN-2017 |
| Register of Charges | Unavailable |
| Important Note | - |
| Name History | 29-JUL-2006 GOLD BOND ENGINEERING MATERIALS LIMITED 金邦工程物料有限公司 |
| Updated | 29-JUL-2006 |
| Previous: GREAT CENTURY PRINTING LIMITED Next: GOLD TORA INTERNATIONAL INVESTMENT LIMITED |
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| What is the CR No of GOLD BOND ENGINEERING MATERIALS LIMITED company? |
| The CR No of GOLD BOND ENGINEERING MATERIALS LIMITED is 1063221 |
| What is the registration or incorporation date of GOLD BOND ENGINEERING MATERIALS LIMITED company? |
| The GOLD BOND ENGINEERING MATERIALS LIMITED was incorporated on 29-JUL-2006 |
| What is the company type description of GOLD BOND ENGINEERING MATERIALS LIMITED company? |
| The company type description of GOLD BOND ENGINEERING MATERIALS LIMITED company is Private company limited by shares |
| What is the address of GOLD BOND ENGINEERING MATERIALS LIMITED company? |
| The address of GOLD BOND ENGINEERING MATERIALS LIMITED company is Unavailable |
| What is the postal code of GOLD BOND ENGINEERING MATERIALS LIMITED company? |
| The postal code of GOLD BOND ENGINEERING MATERIALS LIMITED company is Unavailable |